Bourns Hall

Colloquium

Michael Mello Intel Corporation MECHANICS and MATERIALS CHALLENGES IN ELECTRONIC PACKAGING Abstract Electronic packaging has typically been defined as providing an enabling function and a space transformer between the IC feature sizes and the board & system level interconnects and has grown to become a ubiquitous part of the overall electronic assembly. However, in certain market segments, such as flash memories, the package has evolved to become a key product differentiator and performance enabler. The scope of electronic packaging is very broad across multiple application areas such as CPU’s and Chipsets for the desktop, mobile and server segments, hand-held and wireless devices, telecom components & network processors, and memory devices; with each segment potentially having its unique set of demands and constraints such as the form factor, function, cost, reliability requirements, thermal and electrical performance. To ensure that right technical and cost-effective solutions are defined, developed and deployed across the different market segments, electronic packaging provides significant research and development challenges and opportunities across multiple disciplines including materials, mechanics, reliability, thermals, high speed interconnects, power delivery and manufacturing. This presentation will first provide an overview of current and future package technologies and associated demands in the different market segments, followed by a focus on current metrology challenges in the areas of mechanical model validation and material strength and property characterization. Biosketch Michael Mello has been a Senior Packaging Engineer at Intel Corporation since 1997. Mike is a member of the Thermal Mechanical Tools & Analysis Group within the Assembly Test & Development Organization located in Chandler Arizona. He is primarily responsible for managing the Mechanical Testing Laboratory at the Intel ATD Chandler site. Mr. Mello received a BS degree in Physics from the Massachusetts State College System in 1985 and an MS degree in Optical Engineering from the University of Rochester - Institute of Optics, in 1988. Prior to his tenure at Intel, Mike was a Senior Research Engineer at the Brown University Division of Engineering from 1988 – 1997 where he focused on high strain rate testing methods and the development of interferometry techniques with application to plate impact testing. Mr. Mello has co-authored several papers on interferometry techniques in the field of Applied Mechanics. He was recently awarded an outstanding paper award at the 2003 ECTC for a paper titled “Laser Spallation Adhesion Metrology for Electronic Packaging Development”. He can be reached by email at michael.mello@intel.com Wednesday, November 3, 2004 Bourns Hall, Room A265 10:10 a.m.-11:00 a.m. (Refreshments will be served at 10:00 a.m.)